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SMART Microsystems’ William Boyce Discusses “Product Design for Wire-Bondability” in the Summer Issue of the MEPTEC Report

Wire bonding is generally considered the most cost-effective and flexible interconnect technology for microelectronic assembly. It is used to manufacture the vast majority of fully packaged semiconductor products. In fact, over 15 trillion interconnects are formed by wire bonding each year. Different types of wire bonding processes include gold ball bonding, fine gauge aluminum wedge bonding, heavy gauge aluminum wedge bonding, and ribbon bonding.

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