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SMART Microsystems’ William Boyce Discusses “Product Design for Wire-Bondability” in the Summer Issue of the MEPTEC Report

Wire bonding is generally considered the most cost-effective and flexible interconnect technology for microelectronic assembly. It is used to manufacture the vast majority of fully packaged semiconductor products. In fact, over 15 trillion interconnects are formed by wire bonding each year. Different types of wire bonding processes include gold ball bonding, fine gauge aluminum wedge bonding, heavy gauge aluminum wedge bonding, and ribbon bonding.

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SMART Microsystems’ William Boyce Discusses “Product Launch - Ready for the Big Day?” in the Spring Issue of the MEPTEC Report

In previous SMART Microsystems articles we have discussed product design concepts and developing a robust manufacturing process in microelectronics. Some of the elements lead-ing up to and ensuring the success of “the big day” (product launch) have been presented. In theory, if an organization executed on a robust design and a properly developed assembly process, there ought to be a flawless launch. If this is the case, then why are so many product launches flawed?

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