microelectronic assembly

Microelectronic Assembly

As North America’s leading full-service microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for your new design, taking it from prototyping through launch in less time, and at a lower cost, than other package assembly suppliers.

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Reliability and

Environmental Life Test

SMART Microsystems’ environmental life testing identifies reliability issues early in your product development. Our contract testing laboratory works directly with you to provide testing solutions that help ensure product quality and reliability. As part of your turn-key product solution, reliability study, or on an as-needed basis for overflow/bandwidth, SMART Microsystems can solve your issues before they become a problem in the field.

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Test & Inspection

and Failure Analysis

SMART Microsystems provides both comprehensive Test & Inspection Services and Failure Analysis in one location, along with expertise in custom microelectronic assembly, allowing SMART Microsystems to help customers reduce overall cost for continuous product improvement.

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Super UV Testing

SMART Microsystems’ Super UV Metal Halide lamp based weathering chamber utilizes higher irradiance UV & Near-Visible spectra, and controlled sample temperature to allow for significant reductions in test time when compared with Fluorescent UV & Xenon chambers.

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Heavy Gauge Wire / Ribbon Bonding

Wire bonding is a commonly used process to create low-cost and reliable electrical interconnects between semiconductor components and mechanical assemblies. Wire bonding is generally considered the most cost-effective and flexible interconnect technology for microelectronic assembly. It is used to manufacture the vast majority of fully packaged semiconductor products.

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