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Wire bonding is a key manufacturing process for microelectronics and MEMS sensor products. The core wire bonding capabilities and expertise at SMART Microsystems support process development, testing, and manufacturing of sub-assemblies designed by our customers. Wire bonding processes are flexible and robust, allowing our customers to quickly realize a microelectronic package assembly solution for their products. For additional information you can call or send us an email to discuss your wire bonding needs.

GOLD BALL BONDING SPECIFICATIONS
•   Wire diameters: 15 to 50µm (0.6 to 2.0 mil)
•   Wire materials: gold
•   Fine pitch capability: 40µm
•   Minimum loop height: 100µm (standard and worked loops)
•   Bond area: 56mm x 80mm
•   Accuracy: +/- 2.0µm
•   Speed: up to 15 bonds/second including programmable looping
•   Looping capability: standard and worked (BGA1-BGA3, Spider, J Wire, CSB)
•   Stand-off Stitch bond (SSB) capable
•   Stud bumping
•   Wire material: gold
•   Speed: Up to 30 bumps/second including programmable smoothing

FINE GAUGE WIRE/RIBBON BONDING
SPECIFICATIONS

•   Wire diameters: 17.5µm to 50µm (0.7 to 2.0 mil)
•   Ribbon: 6x35µm to 25x250µm (0.25x1.4 mil to 1x10 mil)
•   Wire and ribbon materials: aluminum, gold
•   Fine pitch is available
•   Bond area: 305mm x 410mm (12.3” x 16.14”)
•   Accuracy: 1um at 3 sigma
•   Speed: up to 6 wires/second
•   Loop Length:  70 µm up to 20 mm, depending on wire diameter
•   Various loop form functions:
     •  Constant wire length
     •  Constant loop height
     •  Individual loop shapes
    
HEAVY GAUGE WIRE/RIBBON BONDING
SPECIFICATIONS

•   Wire diameters: 100µm to 500µm (4 to 20 mil)
•   Ribbon: 0.075x0.75mm to 0.4mm x 2mm (3x30 mil to 16x80 mil)  
•   Wire and ribbon materials: aluminum, copper
•   Bond area: 300mm x 500mm (13.8” x 19.7”)
•   Accuracy: 2µm at 3 sigma
•    Speed: up to 3 wires/sec

 
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