SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products. As North America’s leading full-service microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for your new design, taking it from prototyping through launch in less overall time and cost than other package assembly suppliers.
NEW SMART Capabilities Brochure Available for DOWNLOAD
SMART Microsystems’ William Boyce Discusses Destructive Wire Bond Shear Testing and Its Purpose in the Summer 2019 Issue of the MEPTEC Report
NEW Environmental Life Test Brochure Available for DOWNLOAD
SMART Microsystems has an experienced technical team, state-of-the-art equipment, and brand-new facilities occupying 15,000 sq. ft. of space, including 5,000 sq. ft. of world-class ISO 6 (class 1000) and ISO 5 (class 100) cleanroom facilities...