SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products. As North America’s leading full-service microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for your new design, taking it from prototyping through launch in less overall time and cost than other package assembly suppliers.


WAFER DICING, INSPECTION AND SORTING • Wafer Dicing
Wafer Inspection
Die Sort

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DIE ATTACH
Die Attach
Solder Reflow
Vacuum Solder Reflow

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WIRE BONDING
Fine Gauge Wire / Ribbon Bonding
Heavy Gauge Wire / Ribbon Bonding
Gold Ball Bonding

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HEAVY GAUGE WIRE AND RIBBON BONDING
Hesse Bondjet Bj939 Heavy Gauge Wire/Ribbon Bonder
Wire Diameters: 100µm to 500µm (4 to 20 mil)
Ribbon: 0.075mm x 0.75mm to 0.3mm x 2mm Wire and Ribbon Material: Aluminum

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ENCAPSULATION AND DISPENSING
Adhesive Dispense
Lid Seal
Parylene Coating

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