SMART Microsystems’ William Boyce Discusses “Destructive Wire Bond Testing for Development and Production” in the Spring Issue of the MEPTEC Report
Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. In fact, over 15 trillion interconnects are formed by wire bonding each year. With that said wire bonding interconnects have also long been the bane of the existence of many process and manufacturing engineers. The process engineering and development takes extensive effort involving destructive pull and shear testing as well as multifactorial design of experiments. Once the process is developed and released to manufacturing, the manufacturing engineering teams are tasked with the responsi-bility of keeping the process centered in the process window, also requiring some level of destructive testing.
SMART Microsystems’ William Boyce Discusses “Quality Management Systems in the Microelectronic Assembly Business” in the Winter Issue of the MEPTEC Report
There are many quality management systems that are used in the microelectronic assembly business. AS9100 is for aerospace, IATF for automotive, ISO13485 for medical, ISO17025 for calibration and test labs, just to mention a few. Most of these standards are based from the ISO9001 QMS, and for good reason, ISO 9001 is viewed by most people as the minimum table stakes of good business practice. At SMART Microsystems, we have chosen to be ISO 9001-2015 registered, completing our third annual reassessment external audit in November.
SMART Microsystems’ William Boyce Discusses “Engineering Drawings ”The Language of Engineering” in the Fall Issue of the MEPTEC Report
There are several reasons that an engineering drawing is an invaluable tool. The mere act of generating this document forces the engineer and design team to think critically about every aspect of the process and the part. Critical thought must be given to how a part is fabricated, assembled, and measured. The ability to measure a process or part is very important. In the engineering world, anything that cannot be measured does not exist. Therefore, without the ability to measure the process, the part cannot be fabricated.
SMART Microsystems’ William Boyce Discusses “Product Design for Wire-Bondability” in the Summer Issue of the MEPTEC Report
Wire bonding is generally considered the most cost-effective and flexible interconnect technology for microelectronic assembly. It is used to manufacture the vast majority of fully packaged semiconductor products. In fact, over 15 trillion interconnects are formed by wire bonding each year. Different types of wire bonding processes include gold ball bonding, fine gauge aluminum wedge bonding, heavy gauge aluminum wedge bonding, and ribbon bonding.