Wire bonding is a key manufacturing process for microelectronics and MEMS sensor products. The core wire bonding capabilities and expertise at SMART Microsystems support process development, testing, and manufacturing of sub-assemblies designed by our customers. Wire bonding processes are flexible and robust, allowing our customers to quickly realize a microelectronic package assembly solution for their products. For additional information you can call or send us an email to discuss your wire bonding needs.

FINE GAUGE WIRE / RIBBON BONDING
SPECIFICATIONS
•   Wire diameters: 17.5µm to 50µm (0.7 to 2.0 mil)
•   Ribbon: 6x35µm to 25x250µm (0.25x1.4 mil to 1x10 mil)
•   Wire and ribbon materials: aluminum, gold
•   Fine pitch is available
•   Bond area: 305mm x 410mm (12.3” x 16.14”)
•   Accuracy: 1um at 3 sigma
•   Speed: up to 6 wires/second
•   Loop Length:  70 µm up to 20 mm, depending on wire diameter
•   Various loop form functions:
     •  Constant wire length
     •  Constant loop height
     •  Individual loop shapes
    
HEAVY GAUGE WIRE / RIBBON BONDING
SPECIFICATIONS
•   Wire diameters: 100µm to 500µm (4 to 20 mil)
•   Ribbon: 0.075x0.75mm to 0.4mm x 2mm (3x30 mil to 16x80 mil)  
•   Wire and ribbon materials: aluminum
•   Bond area: 300mm x 500mm (13.8” x 19.7”)
•   Accuracy: 2µm at 3 sigma
•    Speed: up to 3 wires/sec

Learn More About Heavy Gauge Wire and Ribbon Bonding