TEST & INSPECTION AND FAILURE ANALYSIS DATA SHEET
By using Environmental Life Testing and Test and Inspection in conjunction with a Test Early-Test Often approach in the product development cycle, weaknesses in the design are found early, before too much value is added to the part.
WAFER DICING, INSPECTION AND SORTING DATA SHEET
Depending on the substrate material and thickness, we use different dicing blade thicknesses and materials to saw wafers. Our dicing services include wafer inspection and die sorting if required. Diced wafers can be shipped on the tape hoop, or sorted into waffle pack or Gel-Pak.
DIE ATTACH DATA SHEET
The die attach capabilities and expertise at SMART Microsystems support the process development, testing, and manufacturing of sub-assemblies designed by our customers allowing them to quickly realize a microelectronic package assembly solution for their products.
WIRE BONDING DATA SHEET
The core wire bonding capabilities and expertise at SMART Microsystems support process development, testing, and manufacturing of sub-assemblies designed by our customers. Wire bonding processes are flexible and robust, allowing our customers to quickly realize a microelectronic package assembly solution for their products.
ENCAPSULATION AND DISPENSING DATA SHEET
The encapsulation capabilities and expertise at SMART Microsystems support the process development, testing, and manufacturing of sub-assemblies designed by our customers allowing them to quickly realize a microelectronic package assembly solution for their products.
RELIABILITY AND ENVIRONMENTAL LIFE TEST DATA SHEET
SMART Microsystems’ environmental life testing identifies reliability issues early in your product development. Our contract testing laboratory works directly with you to provide testing solutions that help ensure product quality and reliability.
